Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM.

Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

W631GU6MB-12

W631GU6MB-12

Winbond Electronics Corporation

Description

IC DRAM 1GBIT PARALLEL 96VFBGA

10 972

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W9712G6KB-25 TR

W9712G6KB-25 TR

Winbond Electronics Corporation

Description

IC DRAM 128MBIT PARALLEL 84TFBGA

10 921

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W9816G6JB-6I

W9816G6JB-6I

Winbond Electronics Corporation

Description

IC DRAM 16MBIT PARALLEL 60VFBGA

10 900

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W25Q256JVBIM

W25Q256JVBIM

Winbond Electronics Corporation

Description

IC FLSH 256MBIT SPI/QUAD 24TFBGA

10 829

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W25Q64JVSSIM

W25Q64JVSSIM

Winbond Electronics Corporation

Description

IC FLASH 64MBIT SPI/QUAD 8SOIC

10 867

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W25Q80JVSSIQ

W25Q80JVSSIQ

Winbond Electronics Corporation

Description

IC FLASH 8MBIT SPI 133MHZ 8SOIC

10 936

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W9412G6KH-5

W9412G6KH-5

Winbond Electronics Corporation

Description

IC DRAM 128MBIT PAR 66TSOP II

10 892

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W9751G8NB25I

W9751G8NB25I

Winbond Electronics Corporation

Description

IC DRAM 512MBIT PARALLEL 60VFBGA

10 826

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W631GG6MB12I TR

W631GG6MB12I TR

Winbond Electronics Corporation

Description

IC DRAM 1GBIT PARALLEL 96VFBGA

10 964

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W987D2HBJX6E TR

W987D2HBJX6E TR

Winbond Electronics Corporation

Description

IC DRAM 128MBIT PARALLEL 90VFBGA

10 891

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