Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM.

Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

W632GU6KB-15

W632GU6KB-15

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 96WBGA

10 860

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W25Q16JVSNJM TR

W25Q16JVSNJM TR

Winbond Electronics Corporation

Description

IC FLASH 16MBIT SPI/QUAD 8SOIC

10 847

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W25Q128FVCIG

W25Q128FVCIG

Winbond Electronics Corporation

Description

IC FLSH 128MBIT SPI/QUAD 24TFBGA

10 998

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W948D6FBHX5G

W948D6FBHX5G

Winbond Electronics Corporation

Description

IC DRAM 256MBIT PARALLEL 60VFBGA

10 896

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W632GG8KB-15

W632GG8KB-15

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 78WBGA

10 821

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W9864G6IH-6

W9864G6IH-6

Winbond Electronics Corporation

Description

IC DRAM 64MBIT PAR 54TSOP II

10 896

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W25Q32FWZEIG

W25Q32FWZEIG

Winbond Electronics Corporation

Description

IC FLASH 32MBIT SPI/QUAD 8WSON

10 820

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W25Q128FVEIQ

W25Q128FVEIQ

Winbond Electronics Corporation

Description

IC FLASH 128MBIT SPI/QUAD 8WSON

10 851

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W632GU8MB12I TR

W632GU8MB12I TR

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 78VFBGA

10 868

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W25Q32FVSFJQ

W25Q32FVSFJQ

Winbond Electronics Corporation

Description

IC FLASH 32MBIT SPI/QUAD 16SOIC

10 945

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