Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM.

Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

W987D2HBJX6E

W987D2HBJX6E

Winbond Electronics Corporation

Description

IC DRAM 128MBIT PARALLEL 90VFBGA

10 896

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W971GG8SS25I

W971GG8SS25I

Winbond Electronics Corporation

Description

IC DRAM 1GBIT SSTL 18 60WBGA

11 074

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W29GL512PL9T TR

W29GL512PL9T TR

Winbond Electronics Corporation

Description

IC FLASH 512MBIT PARALLEL 56TSOP

10 991

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W29GL512PL9B TR

W29GL512PL9B TR

Winbond Electronics Corporation

Description

IC FLSH 512MBIT PARALLEL 64LFBGA

10 865

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W25X40CLSNIG TR

W25X40CLSNIG TR

Winbond Electronics Corporation

Description

IC FLASH 4MBIT SPI 104MHZ 8SOIC

10 983

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W9725G8KB-18 TR

W9725G8KB-18 TR

Winbond Electronics Corporation

Description

IC DRAM 256MBIT PARALLEL 60WBGA

10 807

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W29N04GZBIBA

W29N04GZBIBA

Winbond Electronics Corporation

Description

IC FLASH 4GBIT PARALLEL 63VFBGA

10 925

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W972GG6KB-25

W972GG6KB-25

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 84WBGA

10 984

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W25X20CLZPIG TR

W25X20CLZPIG TR

Winbond Electronics Corporation

Description

IC FLASH 2MBIT SPI 104MHZ 8WSON

10 961

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W25Q16JLSSIG

W25Q16JLSSIG

Winbond Electronics Corporation

Description

IC FLASH 16MBIT SPI/QUAD 8SOIC

10 952

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