Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM.

Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

W25Q16JVXGIQ TR

W25Q16JVXGIQ TR

Winbond Electronics Corporation

Description

IC FLASH 16MBIT SPI/QUAD 8XSON

10 877

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W25Q80DVZPIG

W25Q80DVZPIG

Winbond Electronics Corporation

Description

IC FLASH 8MBIT SPI 104MHZ 8WSON

12 856

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W25Q512JVEIQ TR

W25Q512JVEIQ TR

Winbond Electronics Corporation

Description

IC FLASH 512MBIT SPI/QUAD 8WSON

10 857

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W9412G6KH-5 TR

W9412G6KH-5 TR

Winbond Electronics Corporation

Description

IC DRAM 128MBIT PAR 66TSOP II

10 826

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W9725G6KB25I

W9725G6KB25I

Winbond Electronics Corporation

Description

IC DRAM 256MBIT PARALLEL 84WBGA

10 872

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W25Q128JVBIQ

W25Q128JVBIQ

Winbond Electronics Corporation

Description

IC FLSH 128MBIT SPI/QUAD 24TFBGA

10 994

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W632GG6NB-12 TR

W632GG6NB-12 TR

Winbond Electronics Corporation

Description

IC DRAM 2GBIT SSTL 15 96VFBGA

13 816

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W632GU6NB-12

W632GU6NB-12

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 96VFBGA

10 857

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W25Q16JWZPIM

W25Q16JWZPIM

Winbond Electronics Corporation

Description

IC FLASH 16MBIT SPI/QUAD 8WSON

10 895

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W987D2HBJX7E TR

W987D2HBJX7E TR

Winbond Electronics Corporation

Description

IC DRAM 128MBIT PARALLEL 90VFBGA

10 971

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