Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM.

Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

W9464G6KH-5

W9464G6KH-5

Winbond Electronics Corporation

Description

IC DRAM 64MBIT PAR 66TSOP II

10 814

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W29N02GVBIAA

W29N02GVBIAA

Winbond Electronics Corporation

Description

IC FLASH 2GBIT PARALLEL 63FBGA

10 975

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W25Q32JWUUIQTR

W25Q32JWUUIQTR

Winbond Electronics Corporation

Description

IC FLASH 32MBIT SPI/QUAD 8USON

12 650

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W631GG6MB-11 TR

W631GG6MB-11 TR

Winbond Electronics Corporation

Description

IC DRAM 1GBIT PARALLEL 96VFBGA

13 608

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W631GG6MB11I

W631GG6MB11I

Winbond Electronics Corporation

Description

IC DRAM 1GBIT PARALLEL 96VFBGA

10 971

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W25X40CLZPIG TR

W25X40CLZPIG TR

Winbond Electronics Corporation

Description

IC FLASH 4MBIT SPI 104MHZ 8WSON

10 849

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W632GU8NB15I

W632GU8NB15I

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 78VFBGA

10 986

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W25Q128JWBIQ

W25Q128JWBIQ

Winbond Electronics Corporation

Description

IC FLSH 128MBIT SPI/QUAD 24TFBGA

10 969

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W25Q128JVPIM TR

W25Q128JVPIM TR

Winbond Electronics Corporation

Description

IC FLASH 128MBIT SPI/QUAD 8WSON

10 902

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W632GG8NB11I

W632GG8NB11I

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 78VFBGA

10 968

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