Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM.

Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

W9812G6KH-5

W9812G6KH-5

Winbond Electronics Corporation

Description

IC DRAM 128MBIT PAR 54TSOP II

10 947

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W25M512JVEIQ

W25M512JVEIQ

Winbond Electronics Corporation

Description

IC FLSH 512MBIT SPI 104MHZ 8WSON

10 833

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W9725G6KB-18

W9725G6KB-18

Winbond Electronics Corporation

Description

IC DRAM 256MBIT PARALLEL 84WBGA

10 903

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W631GG6MB-15 TR

W631GG6MB-15 TR

Winbond Electronics Corporation

Description

IC DRAM 1GBIT PARALLEL 96VFBGA

10 837

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W988D2FBJX6I

W988D2FBJX6I

Winbond Electronics Corporation

Description

IC DRAM 256MBIT PARALLEL 90VFBGA

10 844

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W9464G6KH-5I TR

W9464G6KH-5I TR

Winbond Electronics Corporation

Description

IC DRAM 64MBIT PAR 66TSOP II

10 920

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W9812G2KB-6

W9812G2KB-6

Winbond Electronics Corporation

Description

IC DRAM 128MBIT PARALLEL 90TFBGA

10 818

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W29GL512SH9B TR

W29GL512SH9B TR

Winbond Electronics Corporation

Description

IC FLSH 512MBIT PARALLEL 64LFBGA

10 991

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W9825G6KH-6

W9825G6KH-6

Winbond Electronics Corporation

Description

IC DRAM 256MBIT PAR 54TSOP II

10 964

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W631GG8MB-12 TR

W631GG8MB-12 TR

Winbond Electronics Corporation

Description

IC DRAM 1GBIT PARALLEL 78VFBGA

10 994

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