3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.

3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.

7X11-5-8815

7X11-5-8815

3M

Description

THERM PAD 279.4MMX177.8MM

10 913

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19.05MMOD-8MMID-25-8810

19.05MMOD-8MMID-25-8810

3M

Description

THERM PAD 19.05MMX8MM 1=25/PK

10 894

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6.35MM-18.57MM-25-8810

6.35MM-18.57MM-25-8810

3M

Description

THERM PAD 18.57MMX6.35MM 1=25/PK

10 944

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18.8MM-15.24MM-25-8810

18.8MM-15.24MM-25-8810

3M

Description

THERM PAD 18.8MMX15.24MM 1=25/PK

10 822

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8810-RECTIFIER

8810-RECTIFIER

3M

Description

THERM PAD W/ADH WHITE

10 999

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8926-025 2

8926-025 2" X 10M

3M

Description

THERM PAD 10M X 50.8MM W/ADH WHT

10 849

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14.99MM-25.91MM-25-8810

14.99MM-25.91MM-25-8810

3M

Description

THERM PAD 25.91MMX15MM 1=25/PK

10 853

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19.05MM-28.45MM-25-8810

19.05MM-28.45MM-25-8810

3M

Description

THERM PAD 28.45MMX19.05MM 1=25PK

10 890

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24MM-5M-0.5MM-5550H

24MM-5M-0.5MM-5550H

3M

Description

THERMALLY COND ACRYLIC 24MMX5M (

10 888

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18MM-5M-1.0MM-5550H

18MM-5M-1.0MM-5550H

3M

Description

THERMALLY COND ACRYLIC 18MMX5M (

10 871

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