3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.

3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.

3M 8926-05 1

3M 8926-05 1" X 10M

3M

Description

THERM PAD 10M X 25.4MM W/ADH WHT

10 956

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5590H-05-2

5590H-05-2"-CIRCLE-100/PK

3M

Description

THERM PAD 50.8MM DIA GRAY

11 169

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3M 8810 CIRCLE-2

3M 8810 CIRCLE-2"-100

3M

Description

THERM PAD 50.8MM DIA W/ADH WHITE

10 881

More on Order

40.8MM-26.9MM-25-8810

40.8MM-26.9MM-25-8810

3M

Description

THERM PAD 40.8MMX26.9MM 1=25/PK

10 834

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9882 1 IN X 36 YD

9882 1 IN X 36 YD

3M

Description

THERM PAD 32.92MX25.4MM W/ADH

10 933

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3M 5590H-05 240MM X 9

3M 5590H-05 240MM X 9"

3M

Description

THERM PAD 240MMX228.6MM 1=1PC

11 071

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5590H-05-300MM

5590H-05-300MM

3M

Description

THERM PAD GRY/WHT

10 923

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120MM-1M-0.5MM-5590H

120MM-1M-0.5MM-5590H

3M

Description

THERM PAD 1MX120MM GRAY

10 931

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3M 8805 CIRCLE-2

3M 8805 CIRCLE-2"-100

3M

Description

THERM PAD 50.8MM DIA W/ADH WHITE

10 966

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5584 210 MM X 300 MM X 1.5MM

5584 210 MM X 300 MM X 1.5MM

3M

Description

THERM PAD 300MMX210MM WHITE

10 978

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